Packaging Substrate Engineer
Apple
San Francisco, California
Posted 2 weeks ago
5% International travel
Responsibilities
Primary Duties
- Lead SoC package substrate technology development, pathfinding, and roadmap definition
- Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM
- Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions
- Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap
- Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability
- Problem solving of technical issues during the full product development cycle
Experience Requirements
Required
3+ years of relevant industry experience
Benefits & Perks
Benefits Package
- Comprehensive medical and dental coverage
- Retirement benefits
- Discounted products and free services
- Reimbursement for certain educational expenses including tuition
Required Skills
Technical Skills
In-depth knowledge of substrate technologyManufacturing processDesign rulesHands-on experience in substrate manufacturingTechnology developmentExperience in Cadence Allegro platform toolsDesign review for manufacturing (DFM)
Soft Skills
Exceptional technology development & project management skillsStrong communication & collaborative skills
Full Job Description
Packaging Substrate Engineer
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.
• Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
• Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability, etc.
• Problem solving of technical issues during the full product development cycle.
Qualifications:
• BS and 3+ years of relevant industry experience.
• MS and or Ph.D. and 3+ years of relevant industry experience.
• In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish, etc.
• Familiarity with package assembly and integration process preferred.
• Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
• Exceptional technology development & project management skills.
• Strong communication & collaborative skills.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $147,400 and $272,100, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
Apple accepts applications to this posting on an ongoing basis.
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.
• Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
• Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability, etc.
• Problem solving of technical issues during the full product development cycle.
Qualifications:
• BS and 3+ years of relevant industry experience.
• MS and or Ph.D. and 3+ years of relevant industry experience.
• In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish, etc.
• Familiarity with package assembly and integration process preferred.
• Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
• Exceptional technology development & project management skills.
• Strong communication & collaborative skills.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $147,400 and $272,100, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
Apple accepts applications to this posting on an ongoing basis.
How to Apply
$99
/ hour
Apple pays $99 for Electrical Engineer in San Francisco, California, with most salaries ranging from $64 to $159. Pay can vary based on role, experience, and local cost of living.
Median
$99
Low
$64
High
$159
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